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1

Evaluation of Si liquid cooling structure with microchannel and TSV for 3D application

Park, Manseok, Kim, Sungdong, Kim, Sarah Eunkyung

Journal:

Microsystem Technologies

Year:

2017

Language:

english

File:

PDF, 1.74 MB

english, 2017

2

Study of thinned Si wafer warpage in 3D stacked wafers

Youngrae Kim, Sung-Keun Kang, Sarah Eunkyung Kim

Journal:

Microelectronics Reliability

Year:

2010

Language:

english

File:

PDF, 840 KB

english, 2010

3

[IEEE 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2018.12.4-2018.12.7)] 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Effect of Ar-N2Plasma Treatment on Copper Surface for Cu-to-Cu Wafer Bonding

Park, Hae-Sung, Kim, Sarah Eunkyung

Year:

2018

Language:

english

File:

PDF, 379 KB

english, 2018

4

Dynamic flow measurements of capillary underfill through a bump array in flip chip package

Seok Hwan Lee, Jaeyong Sung, Sarah Eunkyung Kim

Journal:

Microelectronics Reliability

Year:

2010

Language:

english

File:

PDF, 974 KB

english, 2010

5

Characterization of flip chip bonded structure with Cu ABL power bumps

Ma, Junsung, Kim, Sungdong, Kim, Sarah Eunkyung

Journal:

Microelectronics Reliability

Year:

2014

Language:

english

File:

PDF, 2.45 MB

english, 2014

6

Process and characterization of photo-definable organic–inorganic dielectric for wafer level packaging

Song, Changmin, Kim, Sarah Eunkyung

Journal:

Microsystem Technologies

Year:

2019

Language:

english

File:

PDF, 1.43 MB

english, 2019

7

Two-Step Plasma Treatment on Copper Surface for Low Temperature Cu Thermo-Compression Bonding

Park, Haesung, Kim, Sarah Eunkyung

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2019

Language:

english

File:

PDF, 1.33 MB

english, 2019

8

[IEEE 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Kanazawa, Japan (2019.5.21-2019.5.25)] 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Effect of Nitride Passivation on Cu Surface for Low Temperature Cu-to-Cu Bonding

Park, Hae-Sung, Seo, Hankyeol, Kim, Sarah Eunkyung

Year:

2019

File:

PDF, 366 KB

2019

9

[IEEE 2019 International 3D Systems Integration Conference (3DIC) - Sendai, Japan (2019.10.8-2019.10.10)] 2019 International 3D Systems Integration Conference (3DIC) - Effects of Argon and Nitrogen ion Bombardments on Sputtered and Electroplated Cu Surfaces for Cu Bonding Application

Seo, Han Kyeol, Park, Hae-Sung, Kim, Sarah Eunkyung

Year:

2019

File:

PDF, 1.03 MB

2019

10

Stress analysis of stacked Si wafer in 3D WLP

Ki-Ho Maeng, Youngrae Kim, Sung-Geun Kang, Sung-Dong Kim, Sarah Eunkyung Kim

Journal:

Current Applied Physics

Year:

2011

Language:

english

File:

PDF, 773 KB

english, 2011

11

Nitrogen-doped transparent tin oxide thin films deposited by sputtering

Youngrae Kim, Sun-Phil Kim, Sung-Dong Kim, Sarah Eunkyung Kim

Journal:

Current Applied Physics

Year:

2011

Language:

english

File:

PDF, 489 KB

english, 2011

12

Wafer warpage analysis of stacked wafers for 3D integration

Youngrae Kim, Sung-Keun Kang, Sung-Dong Kim, Sarah Eunkyung Kim

Journal:

Microelectronic Engineering

Year:

2012

Language:

english

File:

PDF, 1.09 MB

english, 2012

13

Wafer level package with thermal-stress-absorbing interface structure and elongated pad

Gu-Sung Kim, Sarah Eunkyung Kim

Journal:

Microelectronic Engineering

Year:

2012

Language:

english

File:

PDF, 685 KB

english, 2012

14

Three-Dimensional Dual-Porous Structure Developed by Preferential∕Stain Etching on Grind-Damaged (001) Si: Formation and Optical Properties

Woo, Tae-Ki, Kim, Seoung-Il, Kim, Sarah Eunkyung, Ahn, Hyo-Sok

Journal:

Journal of The Electrochemical Society

Year:

2012

Language:

english

File:

PDF, 512 KB

english, 2012

15

The effects of heat treatment on room temperature ferromagnetism in a digitally Co doped ZnO thin film

Sung-geun Kang, Youngrae Kim, Sarah Eunkyung Kim, Sungdong Kim

Journal:

Electronic Materials Letters

Year:

2013

Language:

english

File:

PDF, 748 KB

english, 2013

16

Effect of radio frequency power on the properties of p-type SnO deposited via sputtering

Um, Joseph, Roh, Byeong-Min, Kim, Sungdong, Eunkyung Kim, Sarah

Journal:

Materials Science in Semiconductor Processing

Year:

2013

Language:

english

File:

PDF, 1.20 MB

english, 2013

17

Experimentally Derived Catalytic Etching Kinetics for Defect-Utilized Dual-Porous Silicon Formation

Woo, Tae-Ki, Kim, Sarah Eunkyung, Ahn, Hyo-Sok

Journal:

The Journal of Physical Chemistry C

Year:

2012

Language:

english

File:

PDF, 3.48 MB

english, 2012

18

Argon plasma treatment on Cu surface for Cu bonding in 3D integration and their characteristics

Park, Manseok, Baek, Soojung, Kim, Sungdong, Kim, Sarah Eunkyung

Journal:

Applied Surface Science

Year:

2015

Language:

english

File:

PDF, 1.49 MB

english, 2015

19

Wafer level Cu–Cu direct bonding for 3D integration

Kim, Sarah Eunkyung, Kim, Sungdong

Journal:

Microelectronic Engineering

Year:

2015

Language:

english

File:

PDF, 1.89 MB

english, 2015

20

[IEEE 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) - Grenoble, France (2015.5.18-2015.5.21)] 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) - Experimental characterization of TSV liquid cooling for 3D integration

Park, Manseok, Kim, Sungdong, Kim, Sarah Eunkyung

Year:

2015

File:

PDF, 400 KB

2015

21

Thermal assessment of copper through silicon via in 3D IC

Shin, Younhwan, Kim, Sarah Eunkyung, Kim, Sungdong

Journal:

Microelectronic Engineering

Year:

2016

File:

PDF, 1.03 MB

2016

22

[IEEE 2011 IEEE International 3D Systems Integration Conference (3DIC) - Osaka (2012.01.31-2012.02.2)] 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International - Evaluation of wafer level Cu bonding for 3D integration

Kang, Sung-Geun, Kim, Youngrae, Kim, Eun-Sol, Lim, Naeun, Jeong, Teakgyu, Lee, Jieun, Kim, Sarah Eunkyung, Kim, Sungdong

Year:

2012

File:

PDF, 324 KB

2012

23

Thermal assessment of copper through silicon via in 3D IC

Shin, Younhwan, Kim, Sarah Eunkyung, Kim, Sungdong

Journal:

Microelectronic Engineering

Year:

2016

Language:

english

File:

PDF, 1.03 MB

english, 2016

24

[IEEE 2011 IEEE International 3D Systems Integration Conference (3DIC) - Osaka (2012.01.31-2012.02.2)] 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International - Evaluation of wafer level Cu bonding for 3D integration

Kang, Sung-Geun, Kim, Youngrae, Kim, Eun-Sol, Lim, Naeun, Jeong, Teakgyu, Lee, Jieun, Kim, Sarah Eunkyung, Kim, Sungdong

Year:

2012

Language:

english

File:

PDF, 324 KB

english, 2012

25

[IEEE 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) - Grenoble, France (2015.5.18-2015.5.21)] 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) - Analysis of thermal effects of through silicon via in 3D IC using Infrared microscopy

Shin, Yoonhwan, Kim, Sarah Eunkyung, Kim, Sungdong

Year:

2015

Language:

english

File:

PDF, 680 KB

english, 2015

26

Fabrication of Advanced Bump Layer for IC Power Delivery

Oh, Keonghwan, Ma, Jun-Sung, Kim, Sungdong, Kim, Sarah Eunkyung

Journal:

Journal of Nanoscience and Nanotechnology

Year:

2013

Language:

english

File:

PDF, 932 KB

english, 2013

27

Exploring the intellectual structure of nanoscience and nanotechnology: journal citation network analysis

Jo, Haejin, Park, Yongtae, Kim, Sarah Eunkyung, Lee, Hakyeon

Journal:

Journal of Nanoparticle Research

Year:

2016

Language:

english

File:

PDF, 1.53 MB

english, 2016

28

Experimental assessment of on-chip liquid cooling through microchannels with de-ionized water and diluted ethylene glycol

Won, Yonghyun, Kim, Sungdong, Kim, Sarah Eunkyung

Journal:

Japanese Journal of Applied Physics

Year:

2016

Language:

english

File:

PDF, 1.78 MB

english, 2016

29

Transparent SnOx thin films fabricated by radio frequency reactive sputtering with a SnO/Sn composite target

Kim, Cheol, Kim, Sungdong, Kim, Sarah Eunkyung

Journal:

Thin Solid Films

Year:

2017

Language:

english

File:

PDF, 1.90 MB

english, 2017

30

Comparative Analysis of SnO x Thin Films Deposited by RF Reactive Sputtering with Different SnO/Sn Target Compositions

Kim, Cheol, Cho, Seungbum, Kim, Sungdong, Kim, Sarah Eunkyung

Journal:

ECS Journal of Solid State Science and Technology

Year:

2017

Language:

english

File:

PDF, 3.06 MB

english, 2017

31

Nitrogen passivation formation on Cu surface by Ar–N2 plasma for Cu-to-Cu wafer stacking application

Park, Haesung, Kim, Sarah Eunkyung

Journal:

Microsystem Technologies

Year:

2018

Language:

english

File:

PDF, 2.46 MB

english, 2018

32

Process and characterization of photo-definable organic–inorganic dielectric for wafer level packaging

Song, Changmin, Kim, Sarah Eunkyung

Journal:

Microsystem Technologies

Year:

2019

File:

PDF, 1.43 MB

2019

33

[IEEE 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2018.12.4-2018.12.7)] 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Effect of Ar-N2Plasma Treatment on Copper Surface for Cu-to-Cu Wafer Bonding

Park, Hae-Sung, Kim, Sarah Eunkyung

Year:

2018

File:

PDF, 379 KB

2018

34

[IEEE 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2018.12.4-2018.12.7)] 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Surface Planarization of Polymeric Interlayer Dielectrics for FOWLP Applications

Kang, Soojung, Kim, Yejin, Moon, Ayoung, Lee, Sangwon, Kim, Sarah Eunkyung, Kim, Sungdong

Year:

2018

Language:

english

File:

PDF, 295 KB

english, 2018

35

Two-Step Plasma Treatment on Sputtered and Electroplated Cu Surfaces for Cu-To-Cu Bonding Application

Seo, Hankyeol, Park, Hae Sung, Kim, Sarah Eunkyung

Journal:

Applied Sciences

Year:

2019

Language:

english

File:

PDF, 5.24 MB

english, 2019

36

[IEEE 2019 International 3D Systems Integration Conference (3DIC) - Sendai, Japan (2019.10.8-2019.10.10)] 2019 International 3D Systems Integration Conference (3DIC) - Characterization of Nitride Passivated Cu Surface for Low-Temperature Cu-Cu Bonding

Park, Hae-Sung, Seo, Han Kyeol, Kim, Sarah Eunkyung

Year:

2019

File:

PDF, 1012 KB

2019

37

[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Development of CMOS-Compatible Low Temperature Cu Bonding Optimized by the Response Surface Methodology

Park, Haesung, Park, Manseok, Seo, Han Kyeol, Eunkyung Kim, Sarah

Year:

2020

File:

PDF, 1.66 MB

2020

38

Comprehensive Analysis of a Cu Nitride Passivated Surface that Enhances Cu-to-Cu Bonding

Seo, Hankyeol, Park, Haesung, Kim, Sarah Eunkyung

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2020

File:

PDF, 1.16 MB

2020

39

[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Effects of two-step plasma treatment on Cu and SiO 2 surfaces for 3D bonding applications

Seo, Han Kyeol, Eunkyung Kim, Sarah, Kim, Gahui, Park, Hae Sung, Park, Young-Bae

Year:

2020

File:

PDF, 852 KB

2020

40

Anti-oxidant copper layer by remote mode N2 plasma for low temperature copperâcopper bonding

Park, Haesung, Seo, Hankyeol, Kim, Sarah Eunkyung

Journal:

Scientific Reports

Year:

2020

File:

PDF, 2.53 MB

2020

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